System-on-Chip IC Test Platform

A client in the semiconductor industry asked to Nuvation to create this platform for power supply testing and functionality testing of a multi-chip module in a large Ball Grid Array (BGA) form factor.

Ball-Grid-Array-IC-Test-Board

Design Features:

 

  • 12-layer PCB Board
  • Altera Cyclone V FPGA for signal I/O and test co-ordination
  • 1760 pin thru-hole BGA socket, 1 mm pitch for multi-chip module
  • 16 margined power supplies (GE Industrial PicoDLynx modules) controlled via PMBus
  • Power sequencing, adjustable power rail voltages
  • Power rail voltage and current measuring
  • Challenging layout to provide up to 13A on some power rails into large socket thru-hole array